Holding apparatus, exposure apparatus and manufacturing method of device

ABSTRACT

A holding apparatus includes a holding portion that includes a first member which contacts a portion of an object, a second member which at least a portion thereof is fixed to a base, and a connection member which is configured to connect the first and second members, and a driving unit which drives the holding portion to change at least a posture of the first member, wherein a relative positional relationship between the first member and the second member is changed via the connection member.

TECHNICAL FIELD

The present invention relates to a holding apparatus which can hold anobject, an exposure apparatus, an exposure method, and a manufacturingmethod of a device.

This application is a U.S. national stage application ofPCT/JP2012/053803 filed Feb. 17, 2012 and claims foreign priorty benefitof Japanese Patent Application No. 2011-035412, filed on Feb. 22, 2011,the contents of both of which are incorporated herein by reference.

BACKGROUND ART

In a so-called a lithography process which transfers a pattern formed ona mask or a reticle (hereinafter, collectively referred to as the“mask”) to a photosensitive substrate, an exposure apparatus is usedwhich projects the pattern of the mask held to a mask stage to each shoton the photosensitive substrate via a projection optical system.

In recent years, in the exposure apparatus, higher resolution of theprojection optical system is required to correspond to higherintegration of the pattern. The resolution of the projection opticalsystem is increased as the used exposure wavelength is shortened and anumerical aperture of the projection optical system is increased.Accordingly, the exposure wavelength used in the exposure apparatus isshortened year by year, and the numerical aperture of the projectionoptical system is also increased. Currently, a mainstream exposurewavelength is 248 nm of KrF excimer laser and 193 nm of ArF excimerlaser. Moreover, when exposure is performed, similar to the resolution,a depth of focus (DOF) is also important. The resolution R and the depthof focus δ are represented by the following Expressions (1) and (2).R=k1·λ/NA  (1)δ=±k2·λ/NA2  (2)

Here, λ is the exposure wavelength, NA is the numerical aperture of aprojection exposure system, and k1 and k2 are process coefficients.

According to Expressions (1) and (2), in order to increase theresolution R, it is understood that the depth of focus δ is decreased ifthe exposure wavelength λ is decreased and the numerical aperture NA isincreased.

If the depth of focus δ is narrowed too much, it is difficult to make asubstrate surface coincide with an image surface of the projectionoptical system, and there is a concern that a focus margin may beinsufficient when the exposure operation is performed. Accordingly, as amethod which substantially shortens the exposure wavelength and widensthe depth of focus, for example, a liquid immersion method disclosed inPatent Document 1 below is suggested. In the liquid immersion method,liquid such as pure water or organic solvent is filled between a mask ofa projection optical system and a substrate surface, resolution isimproved using a wavelength of exposure light in the liquid becoming 1/n(n is a refractive index in air and approximately 1.2 to 1.6 in general)in air, the depth of focus is enlarged to be approximately n times, anda liquid immersion exposure apparatus which exposes a substrate in highresolution by the liquid immersion method is used.

PRIOR ART DOCUMENT Patent Document

[Patent Document 1] PCT International Publication No. WO 99/49504

SUMMARY OF INVENTION Problems to be Solved by the Invention

However, in the exposure which uses a light source having high energysuch as KrF excimer laser or ArF excimer laser, if the exposure isperformed on the substrate via the projection optical system by thelight source, aberration change is generated in a lens (in general,refractive optical element) which configures the projection opticalsystem. A pattern image surface of the mask is changed by the aberrationchange, and thus, exposure precision of the substrate may bedeteriorated.

An aspect of the present invention provides a holding apparatus, anexposure apparatus, and a manufacturing method of a device for preciselyexposing a pattern formed on the mask on the substrate.

Means for Solving the Problem

According to a first aspect of the present invention, a holdingapparatus is provided, including: a holding portion that comprises afirst member which contacts a portion of an object, a second memberwhich at least a portion thereof is fixed to a base, and a connectionmember which is configured to connect the first and second members; anda driving unit which is configured to drive the holding portion tochange at least a posture of the first member which holds the object,wherein a relative positional relationship between the first member andthe second member is changed via the connection member.

According to a second aspect of the present invention, an exposureapparatus is provided including the holding apparatus according to thefirst aspect of the present invention, wherein holding apparatus iscapable of holding a mask on which a pattern is formed as the object,and the pattern is transferred to a substrate.

According to a third aspect of the present invention, a holdingapparatus is provided, including: a holding portion that comprises afirst member which contacts a portion of the mask, a second member towhich at least a portion of an apparatus main body is fixed, and aconnection member which is configured to connect the first and secondmembers; and a driving unit which is configured to drive the holdingportion to change an inclination of the first member, wherein holdingportion comprises a first holding portion which is configured to holdone end portion of the mask and a second holding portion which isconfigured to hold another end portion of the mask, and the first andsecond holding portions comprise the first member, the second member,and the connection member respectively, the driving unit is configuredto bend the mask by changing an inclination of the first member of thefirst holding portion and an inclination of the first member of thesecond holding portion in directions different from each other, and theconnection member is configured to change a position of the first memberwith respect to the second member according to a change of theinclination of the first member.

According to a fourth aspect of the present invention, an exposureapparatus is provided including the holding apparatus according to thethird aspect of the present invention, wherein the pattern istransferred to a substrate.

According to a fifth aspect of the present invention, an exposure methodis provided, including, the exposure apparatus according to the secondaspect of the present invention and the fourth aspect of the presentinvention, deforming the mask; and transferring the pattern of the maskto the substrate.

According to a sixth aspect of the present invention, a holdingapparatus is provided, including: a holding portion configured to holdthe optical member; a driving unit which is configured to deform theoptical member by driving the holding portion and affecting a bendingmoment around a first axis to the held optical member; and a supportportion which is configured to support the holding portion in a freelydisplaceable manner along the second axis according to the bendingmoment.

According to a seventh aspect of the present invention, an exposureapparatus is provided, including: the holding apparatus according to thesixth aspect of the present invention, wherein the holding apparatus iscapable of holding a mask on which a pattern is formed as an opticalmember, and the pattern is transferred to a substrate.

According to an eighth aspect of the present invention, an exposuremethod is provided, including, using the exposure apparatus according tothe seventh aspect, deforming the mask; and transferring a pattern ofthe mask to the substrate.

According to a ninth aspect of the present invention, a manufacturingmethod of a device is provided, including: exposing the substrate usingthe exposure apparatus according to the second aspect of the presentinvention, the exposure apparatus according to the fourth aspect of thepresent invention, or the exposure apparatus according to the seventhaspect of the present invention; and developing the exposed substrate.

According to a tenth aspect of the present invention, a holdingapparatus is provided, including: a first member which contacts aportion of the object; a second member; a connection member which isconfigured to connect the first member and the second member; and adriving unit which is configured to drive at least one of the firstmember, the second member, and the connection member to change a postureof the first member with respect to the second member.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic configuration view showing an example of anexposure apparatus according to a first embodiment.

FIG. 2 is a plan view showing a mask stage apparatus according to thefirst embodiment and the vicinity thereof.

FIG. 3 is a plan view showing a mask stage according to the firstembodiment.

FIG. 4 is a cross-sectional view taken along B-B of the mask stage inFIG. 3.

FIG. 5 is a cross-sectional view taken along A-A of the mask stageapparatus in FIG. 2.

FIG. 6 is an enlarged cross-sectional view of a mask-holding portion inthe mask stage in FIG. 4.

FIG. 7A is an enlarged cross-sectional view of a mask-holding portionshowing an example of deformation of a mask according to the firstembodiment.

FIG. 7B is an enlarged cross-sectional view of the mask-holding portionshowing the example of the deformation of the mask according to thefirst embodiment.

FIG. 8 is an enlarged cross-sectional view showing another example ofthe mask-holding portion according to the first embodiment.

FIG. 9 is a flowchart for illustrating an example of an operation of theexposure apparatus according to the first embodiment.

FIG. 10 is a modification of the mask-holding portion according to thefirst embodiment.

FIG. 11A is an enlarged view of the mask-holding portion in FIG. 10.

FIG. 11B is a cross-sectional view taken along C-C in the enlarged viewof the mask-holding portion in FIG. 11A.

FIG. 12 is an enlarged cross-sectional view of the mask-holding portionof −X side according to a second embodiment.

FIG. 13 is a flowchart showing an example of a manufacturing process ofa micro-device.

DESCRIPTION OF EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the drawings. However, the present invention is not limitedthereto.

Moreover, in descriptions below, an XYZ rectangular coordinate system isset, and it is described with reference to the XYZ rectangularcoordinate system. A predetermined direction in a horizontal surface isset to an X axis direction, a direction orthogonal to the X axisdirection in the horizontal surface is set to a Y axis direction, and adirection (that is, a vertical direction) orthogonal to each of the Xaxis direction and the Y axis direction is set to a Z axis direction.Moreover, rotation (inclination) directions around the X axis, the Yaxis, and the Z axis are set to θX, θY, and θZ directions respectively.

First Embodiment

A first embodiment of the present invention will be described.

First, a configuration of an exposure apparatus EX of the presentembodiment will be described with reference to FIG. 1.

FIG. 1 is a schematic configuration view showing an example of theexposure apparatus EX in the present embodiment.

The exposure apparatus EX of the present embodiment includes: anillumination unit IL; a mask stage apparatus 1 (holding apparatus, basematerial) which drives a mask M (object, plate-like object, opticalmember, plate-like optical member) in the Y axis direction, which is ascanning direction, by a predetermined stroke and minutely drives themask in the X axis direction, the Y axis direction, and the θZdirection; a mask alignment system MA which is provided near the maskstage apparatus 1; a projection optical system PL; a substrate alignmentsystem WA which is provided near the projection optical system PL; asubstrate stage WS which drives a substrate table WT, which can hold asubstrate W, in an XY two-dimensional direction; a liquid immersionapparatus 15 in which a supply port supplying liquid on the substrate W(substrate table WT) and a recovery port recovering the supplied liquidare provided; a column 2 which holds the mask stage apparatus 1 and theprojection optical system PL; and a controller CONT which controls eachelement of the exposure apparatus EX and the entire operation.

Hereinafter, each element of the configuration of the exposure apparatusEX will be described.

The illumination unit IL includes a light source which emitsillumination light EL and an illumination optical system. Theillumination unit radiates the illumination light EL to a rectangular orarc illumination region which is defined by a field stop (also referredto as a masking blade or a reticle blind) disposed in the inner portionof the illumination unit, and illuminates the mask M, on which a circuitpattern is formed, with uniform illuminance. For example, anillumination system similar to the illumination unit IL is disclosed inU.S. Pat. No. 5,534,970 or the like. Here, as an example, ArF excimerlaser light (wavelength 193 nm) is used for the illumination light EL.

The column 2 is configured of a plurality of legs 16 in which the lowerend portions of the legs are fixed to a floor surface F, and a top plateportion 4 which is supported by the legs 16 at the above of the floorsurface F. An opening 7 which passes through in an up-down direction (Zaxis direction) is formed in a center portion of the top plate portion4. The column 2 holds the mask stage apparatus 1 and the projectionoptical system PL. In the present embodiment, the number of the legs 16is three.

The mask stage apparatus 1 includes a surface plate MBS disposed below(−Z direction) the illumination unit IL, a mask stage MS disposed on thesurface plate MBS, a counter mass 3 configured of a frame-like memberdisposed on the surface plate MBS to surround the mask stage MS, a maskstage-driving apparatus (not shown) which drives the mask stage MS, orthe like.

The surface plate MBS is approximately horizontally supported on the topplate portion 4 of the column 2 via a plurality of vibration isolationunits 5, and an opening 21, which communicates with the opening 7 of thetop plate portion 4 in the Z direction, is formed in the center portionof the surface plate. In the present embodiment, three vibrationisolation units 5 are installed. The mask stage MS is disposed on thesurface plate MBS, and the mask M is held on the mask stage MS. Inaddition, a reflection surface 18 is provided at the mask stage MS, anda mask side laser interferometer 19 is provided at a positioncorresponding to the reflection surface 18. The mask side laserinterferometer 19 radiates a measurement laser to the reflection surface18 of the mask stage MS, detects a measurement laser which is reflectedvia the reflection surface 18, and thus, measures positional informationwith respect to the mask stage MS. In the present embodiment, the maskside laser interferometer 19 measures a position in an XY plane and arotation angle in the θZ direction of the mask stage MS in real time.The controller CONT drives the mask stage-driving apparatus (not shown)based on measured results of the mask side laser interferometer 19, andperforms a position control of the mask M which is held on the maskstage MS. A specific configuration or the like of the mask stageapparatus 1 will be described in detail below.

The mask alignment system MA, which detects a mask alignment mark (notshown) formed on the mask M and a mask reference mark (not shown) formedon the substrate table WT, is provided near the mask stage apparatus 1.In the present embodiment, the mask alignment system MA measures aposition deviation amount of the mask alignment mark with respect to themask reference mark in a coordinate system which is defined by the maskside laser interferometer 19, and performs alignment between the mask Mand the mask reference mark.

In the projection optical system PL, a catadioptric optical system whichis configured of a plurality of lenses (lens element) having a commonoptical axis in the Z axis direction, a terminal optical element 14nearest to the image surface of the projection optical system PL, and areflection optical element is used, and the projection optical system isa both-side telecentric system and has a predetermined projectionmagnification (¼). Accordingly, a portion (illumination region) of themask M is illuminated by the illumination light EL from the illuminationunit IL, the image becomes a reduced image via the projection opticalsystem PL, is coated by a resist (photosensitive material), and isprojected to an exposure region (shot) of the substrate W which isdisposed at the image surface side of the projection optical system PL.

The terminal optical element 14 is formed of fluorite. Since thefluorite has high affinity with water, the fluorite can make liquid comeinto close contact with approximately the entire surface of a liquidcontact surface of the terminal optical element 14.

Moreover, the projection optical system PL may be a dioptric systemconfigured of only a plurality of lenses or a catoptrics systemconfigured of only the reflection optical element. In addition, theprojection magnification of the projection optical system PL need not be¼, but may be ⅕ or ⅛. In addition, the projection optical system neednot be a reduction system, but may be an equal magnification system oran enlargement system. Moreover, the projection optical system PL mayform either an inverted image or an erect image.

In addition, the terminal optical element 14 may be quartz having highaffinity with water, and the affinity with fluid may be increased byperforming hydrophilic treatment (lyophilic treatment) on the liquidcontact surface of the terminal optical element 14.

Moreover, in the projection optical system PL, a lens controller LC isprovided which configure a lens configuring the projection opticalsystem PL to move with respect to the optical axis, and which adjusts arefractive index or temperature of gas in the projection optical systemPL and corrects an aberration. As an example in which the lens isconfigured to move with respect to the optical axis, as disclosed inJapanese Unexamined Patent Application, First Publication No. H05-41344(Corresponding to U.S. Pat. No. 5,424,552), there is an aberrationcorrection method which moves the lens in an optical axis direction,moves (shifts) the lens in a direction orthogonal to the optical axis,or inclines (tilts) the lens with respect to the optical axis.

A flange 6 is provided at approximately the center in the Z axisdirection of a lens barrel of the projection optical system PL. Theprojection optical system PL is supported to be hung to the flange 6portion via a plurality of hanging mechanisms 9 in which one end isfixed to the lower surface side of the top plate portion 4. Each of thehanging mechanisms 9 includes a coil spring 10 or a wire 11 which is aconnection member having a flexible structure. In the presentembodiment, the number of the hanging mechanisms 9 is three.

Moreover, protruding portions 12 are formed near the center portion withrespect to the Z axis direction of each leg 16 of the column 2, and adrive system 13 is provided between each protruding portion 12 and anouter circumferential portion of the flange 6 of the projection opticalsystem PL. The drive system 13 is configured of a voice coil motor whichdrives the lens barrel of the projection optical system PL in a radialdirection and a voice coil motor which drives the projection opticalsystem PL in the optical axis direction. That is, the projection opticalsystem PL is configured to be movable in directions of six degrees offreedom by the drive system 13.

An acceleration sensor (not shown), which detects acceleration indirections of six degrees of freedom of the projection optical systemPL, is provided at the flange 6. The controller CONT controls the driveof the voice coil motor of the drive system 13 based on the accelerationinformation detected by the acceleration sensor so that the projectionoptical system PL becomes stationary with respect to the column 2 andthe floor surface F.

The liquid immersion apparatus 15 is disposed to surround the terminaloptical element 14. The supply port which supplies the liquid and therecovery port which recovers the liquid supplied from the supply portare provided. A liquid supply apparatus (not shown) is connected to thesupply port, and a liquid recovery apparatus (not shown) is connected tothe recovery port. The liquid supply apparatus includes a tank whichaccommodates the liquid, a pressure pump, or the like, and supplies theliquid to the substrate table WT via the supply port. The liquidrecovery apparatus includes a vacuum system (suction apparatus) such asa vacuum pump, a tank which accommodates the recovered liquid, or thelike, and recovers the liquid on the substrate table WT via the recoveryport. A liquid immersion region AR is formed between a lower surface ofthe liquid immersion apparatus 15 and a lower surface of the terminaloptical element 14, and the substrate W (substrate table WT) byadjusting a supply amount of the liquid supplied to the substrate tableWT and a recovery amount of the recovered liquid. In the presentembodiment, the liquid which forms the liquid immersion region AR iswater.

Moreover, the exposure apparatus EX does not necessarily need the tankor the pressure pump which supplies the liquid and the vacuum system orthe tank which recovers the liquid, and facilities in factories in whichthe exposure apparatus EX is installed or the like may be used.

The substrate alignment system WA is provided near the tip of theprojection optical system PL.

The substrate alignment system WA adopts a Field Image Alignment (FIA)method as disclosed in Japanese Unexamined Patent Application, FirstPublication No. H04-65603 (corresponding to U.S. Pat. No. 5,493,403),which illuminates a substrate alignment mark (not shown) formed on theexposure region (shot) of the substrate W or a reference mark for asubstrate (not shown) formed on the substrate table WT by illuminationlight such as white light from a halogen lamp, and measures thepositions of the marks by imaging those mark images with a CCD camera.

The substrate stage WS is supported to be floated via an air bearing orthe like on the upper surface of the surface plate WBS disposed belowthe projection optical system PL. The substrate stage WS can be freelydriven in the XY plane along the upper surface of the surface plate WBSvia a substrate stage drive system (not shown) by the control of thecontroller CONT while holding the substrate W via the substrate tableWT.

The surface plate WBS is provided on the floor surface F. A +Z sidesurface (upper surface) of the surface plate WBS is processed with veryhigh flatness, and becomes a movement reference surface (guide surface)of the substrate stage WS.

A substrate-holding portion (not shown) is provided at the substratetable WT, and the substrate W is held by vacuum adsorption or the likeat the substrate-holding portion. Moreover, the mask reference mark (notshown) detected by the mask alignment system MA and the substratereference mark detected by the substrate alignment system WA areprovided at the substrate table WT. Moreover, a reflection surface 20 isprovided at the substrate table WT, and a substrate side laserinterferometer 17 is provided at a position corresponding to thereflection surface 20.

The substrate side laser interferometer 17 radiates a measurement laserto the reflection surface 20 of the substrate table WT, detects themeasurement laser reflected via the reflection surface 20, and thus,measures the positional information related to the substrate table WT(substrate W). In the present embodiment, the substrate side laserinterferometer 17 measures a position in an XY plane and a rotationangle in the θZ direction of the substrate table WT in real time. Thecontroller CONT drives a substrate stage-driving apparatus (not shown)based on measured results of the substrate side laser interferometer 17,and performs a position control of the substrate W which is held on thesubstrate table WT.

A focus detection system (not shown) is provided near the upper portionof the substrate table WT. The focus detection system includes alight-emitting portion and a light-receiving portion, projects detectionlight on the surface (exposure surface) of the substrate W in aninclined direction from the light-emitting portion, and receives thereflected light by the light-receiving portion. For example, as theconfiguration of the focus detection system, a configuration which isdisclosed in Japanese Unexamined Patent Application, First PublicationNo. H08-37149 (corresponding to U.S. Pat. No. 6,195,154) may be used.The focus detection system detects a position (focus position) in the Zaxis direction of the substrate W in a state where the liquid is notpresent (the liquid immersion region AR is not formed) on the substrateW (the upper surface of the substrate table). Moreover, the θX and θY ofthe substrate W are detected by detecting several positions (focuspositions) in the Z direction of the substrate W. That is, the deviationbetween the image surface of the pattern image of the mask M formed viathe projection optical system PL and the liquid, and the upper surfaceof the substrate W is detected. Moreover, the focus detection system mayproject the detection light on the surface of the substrate W via theliquid.

Next, the specific configuration of the mask stage apparatus 1 will bedescribed with reference to FIG. 2.

FIG. 2 is a plan view showing the mask stage apparatus 1 according tothe present embodiment and the vicinity thereof.

As shown in FIG. 2, when the surface plate MBS is viewed from above, thesurface plate is configured of a plate-like member having anapproximately rectangular shape in which an outer frame of the countermass 3 becomes four sides of the surface plate, and the opening 21 whichbecomes the passage of the illumination light EL is formed in the centerportion of the surface plate. The opening 21 communicates with theabove-described opening 7 (refer to FIG. 1) of the top plate portion 4in the Z direction. Protruding portions MBSa and MBSb extend in the Yaxis direction at positions which are separated at an equal distance inthe −X direction and the +X direction from the center of the uppersurface of the surface plate MBS. The upper surfaces (+Z side surfaces)of the protruding portions MBSa and MBSb are processed with very highflatness, and become guide surfaces when the mask stage MS moves.

Three vibration isolation units 5 provided between the surface plate MBSand the top plate portion 4 include air dampers respectively. Avibration having relatively high frequency is prevented from beingtransmitted to the mask stage MS by the vibration isolation units 5.Moreover, the air damper included in each of the vibration isolationunits 5 may be a mechanical damper such as a hydraulic type.

Furthermore, an X voice coil motor (not shown) which operates thedriving force in the X axis direction to the mask stage surface plateMBS, a Y voice coil motor (not shown) which operates the driving forcein the Y axis direction, and a Z voice coil motor (not shown) whichoperates the driving force in the Z axis direction are provided betweenthe surface plate MBS and the top plate portion 4.

In the present embodiment, the X voice coil motor and the Y voice coilmotor each are provided one by one between the mask stage surface plateMBS and the top plate portion 4, and can move the mask stage surfaceplate MBS in the X axis direction, the Y axis direction, and the θZdirection. Moreover, three Z voice coil motors are provided at threeplaces which are not arranged on a straight line between the mask stagesurface plate MBS and the top plate portion 4, and can move the maskstage surface plate MBS in the Z axis direction, the θX direction, andthe θY direction. Accordingly, the mask stage surface plate MBS can bedriven in the direction of six degrees of freedom (X axis direction, Yaxis direction, Z axis direction, θX direction, θY direction, and θZdirection) with respect to the top plate portion 4.

Moreover, the X voice coil motor and the Y voice coil motor need not beprovided one by one, and at least one of two voice coil motors may beprovided as two.

In addition, three Z voice coil motors need not be provided, and threeor more motors may be provided as long as three motors are provided atthree places which are not arranged on a straight line between the maskstage surface plate MBS and the top plate portion 4.

Moreover, the position of the surface plate MBS is measured by a surfaceplate interferometer (not shown) or a Z encoder (not shown) based on theprojection optical system PL.

The mask stage MS is configured of a stage main body 22 (base), amask-holding portion 23 (holding portion) which holds the mask M and inwhich a portion is fixed to the stage main body 22, and movable elements25 a and 25 b which are fixed to the stage main body 22 and drives themask stage MS. Each of the movable elements 25 a and 25 b engage withstators 26 a and 26 b supported by the counter mass 3 to configure alinear motor.

An opening 24 through which the illumination light EL passes via themask M is formed at the stage main body 22. That is, the illuminationlight EL illuminating the mask M enters the projection optical system PLvia the opening 24, the opening 21 of the surface plate MBS, and theopening 7 of the top plate portion 4.

Hereinafter, the details of the mask stage MS of the present embodimentwill be described with reference to FIGS. 3, 4 and 5.

FIG. 3 is a plan view showing the mask stage MS according to the presentembodiment.

FIG. 4 is a cross-sectional view taken along B-B of the mask stage MS inFIG. 3.

FIG. 5 is a cross-sectional view taken along A-A of the mask stageapparatus 1 in FIG. 2.

As shown in FIG. 3, air-slider portions 27 a and 27 b are installed atregions opposite to each of the protruding portions MBSa and MBSb of thesurface plate MBS at the rear surface (−Z side surface) of the stagemain body 22.

In the air-slider portions 27 a and 27 b, an air supply groove (notshown) and a pair of air discharge grooves (not shown) positioned atboth sides in the X axis direction of the air supply groove are formedover the entire length in the Y axis direction. An air supply port and apair of air discharge ports are formed at each of the upper surface ofthe protruding members MBSa and MBSb of the surface plate MBS, which areopposite to at least a portion of each of the air supply groove and thepair of air discharge grooves respectively. In this way, in the presentembodiment, a so-called differential discharge type gas hydrostaticbearing configured of a surface plate air-supply type is used. Forexample, the differential discharge type gas hydrostatic bearingconfigured of a surface plate air-supply type is disclosed in U.S. Pat.No. 7,489,389.

Moreover, a reference member 60 is provided at the stage main body 22.

The reference member 60 is formed of low expansion glass having a smalllinear heat expansion coefficient. As shown in FIG. 4, a referencesurface 61, which is the lower surface of the reference member 60, isprovided at the stage main body 22 to be approximately flush with thelower surface (pattern surface) of the mask M. In the stage main body22, an opening 70 is formed to correspond to the reference surface 61 ofthe reference member 60, the detection light is radiated (refer toFIG. 1) to the reference surface 61 and the lower surface (patternsurface) of the mask M via a plurality of optical systems (not shown),an opening (not shown) formed in the surface plate MBS, and the opening70 formed in the stage main body 22 from between the surface plate MBSand the top plate portion 4, and a surface position measurement system(not shown) is provided near the mask stage apparatus 1 to detect thereference surface 61 and the lower surface (pattern surface) of the maskM.

As disclosed in PCT International Publication No. WO 2007/119821(corresponding to United States Patent Application, Publication No.2007/0291261), the surface position measurement system (not shown) emitsthe detection light to the reference surface of the reference member 60and the lower surface (pattern surface) of the mask M, receives thereflected light, and thus, the surface position in the Z position of thelower surface (pattern surface) of the mask M is measured based on thesurface position in the Z direction of the reference surface 61 of thereference member 60.

Moreover, in the present embodiment, the surface position measurementsystem (not shown) need not be provided near the mask stage apparatus 1.For example, the surface position measurement system may be provided atside the mask stage apparatus 1 to radiate the detection light to thereference surface 61 and the lower surface (pattern surface) of the maskM via the opening 70 and to measure the surface position of the lowersurface (pattern surface) of the mask M.

Returning to FIG. 3, the movable elements 25 a and 25 b are fixed to theside surfaces of the −X side (−X side from the air-slider portion 27 a)and the +X side (+ side from the air-slider portion 27 b) of the stagemain body 22 respectively.

As shown in FIG. 5, one movable element 25 a includes three movableelement portions 28, 29 and 30 which are disposed to be parallel to eachother with a predetermined interval in the Z axis direction and have theY axis direction as the longitudinal direction. Here, three movableelement portions 28, 29, and 30 are disposed symmetrically in thevertical direction based on a neutral surface (which passes through thecenter of gravity and is parallel to the XY plane) of the stage mainbody portion 22, and the neutral surface of the movable element portionpositioned at the center coincides with the neutral surface of the stagemain body 22.

Magnet units which include a plurality of permanent magnets arrangedalong the Y axis direction are built in each of the movable elementportions 28, 29 and 30. Hereinafter, the magnet units are also indicatedby magnet units 28, 29, and 30 using the same reference numerals as thecorresponding movable element portions. Moreover, in the presentembodiment, in the magnet unit 29 among the magnet units 28, 29, and 30,a protrusion (not shown) is provided at the center portion in the Y axisdirection. One permanent magnet which has the Y axis direction as thelongitudinal direction is accommodated in the protrusion (not shown).

The other movable element 25 b is bilaterally symmetrical to the movableelement 25 a, a similar configuration, and includes three movableelement portions 31, 32 and 33. Magnet units which include a pluralityof permanent magnets arranged along the Y axis direction are built ineach of the three movable element portions 31, 32 and 33. In the magnetunit 32 among the movable element portions 31, 32 and 33, that is, themagnet units 31, 32 and 33, a protrusion (not shown) is provided at thecenter portion in the Y axis direction. One permanent magnet which hasthe Y axis direction as the longitudinal direction is accommodated inthe protrusion (not shown).

The stator 26 a, which engages with the movable element 25 a, includes apair of stator portions 34 and 35 which are disposed to be parallel toeach other with a predetermined interval in the Z axis direction. Thestator portions 34 and 35 are supported to be fixed to the counter mass3 (refer to FIG. 2).

Armature units, which include a plurality of armature coils arrangedalong the Y axis direction, are built in the inner portions of each ofthe stator portions 34 and 35. Hereinafter, the armature units are alsoindicated as armature units 34 and 35 using the same reference numeralsas the corresponding stator portions. In addition, a single coil (notshown) having a long rectangular shape in the Y axis direction isaccommodated at the −X side end portion in the inner portions of thestator portions 34 and 35.

The stator 26 b which engages with the movable element 25 b isbilaterally symmetrical to the stator 26 a, has a similar configuration,and includes a pair of stator portions 36 and 37 which are disposed tobe parallel to each other with a predetermined interval in the Z axisdirection. The stator portions 36 and 37 are supported to be fixed tothe counter mass 3 (refer to FIG. 2).

Armature units, which include a plurality of armature coils arrangedalong the Y axis direction, are built in the inner portions of each ofthe stator portions 36 and 37. Hereinafter, the armature units are alsoindicated as armature units 36 and 37 using the same reference numeralsas the corresponding stator portions. In addition, a single coil (notshown) having a long rectangular shape in the Y axis direction isaccommodated in the +X side end portion in the inner portions of thestator portions 36 and 37.

That is, in the present embodiment, four sets of Y linear motors areconfigured of six magnet units 28 to 33 and four armature units 34 to37, and the controller CONT controls the four sets of Y linear motorsvia the mask stage-driving apparatus and drives the mask stage MS in theY axis direction and the θZ direction.

In addition, in the present embodiment, the number of sets of Y linearmotors is four, but need not be four. For example, the mask stage MS maybe driven by three sets of Y linear motors, and the mask stage MS may bedriven by one set of Y linear motors.

In addition, a total of two X voice coil motors, which are provided tobe bilaterally symmetrical one by one, are configured of theabove-described single coil (not shown) and the permanent magnetincluding the protrusion (not shown) in which upper and lower magnetsurfaces are opposite to the coil.

The controller CONT supplies current to the single coil via the maskstage-driving apparatus (not shown), and can drive the mask stage MS inthe X axis direction by two X voice coil motors.

Moreover, in the present embodiment, the number of X voice coil motorsis two, but need not be two. For example, X voice coil motors areprovided to be bilaterally symmetrical two by two, and thus, a total offour X voice coil motors may be configured, and a total of three X voicecoil motors may be configured, in which one motor is disposed in theleft and two motors are disposed in the right.

The mask-holding portion 23 is configured of a first mask-holdingportion 23 a (first holding portion) which holds the mask M in the −Xside with respect to the opening 24, and a second mask-holding portion23 b (second holding portion) which holds the mask M in the +X side. Aportion of the first mask-holding portion 23 a and a portion of thesecond mask-holding portion 23 b are inclined in directions differentfrom each other. Accordingly, by deforming the mask M which is held tothe first mask-holding portion 23 a and the second mask-holding portion23 b, a change of the pattern image surface of the mask M can becorrected by an aberration change of the projection optical system PL.

The details of the mask-holding portion 23 will be described withreference to FIG. 6.

FIG. 6 is an enlarged cross-sectional view of the mask-holding portion23 in the mask stage MS in FIG. 4.

In the present embodiment, the first mask-holding portion 23 a and thesecond mask-holding portion 23 b have a Z-axis symmetrical structurewith respect to the opening 24. Hereinafter, the configuration of thefirst mask-holding portion 23 a positioned in the −X side with respectto the opening 24 will be described. The descriptions of theconfiguration of the second mask-holding portion 23 b are omitted.However, each configuration of the second mask-holding portion 23 b isindicated by replacing suffixes of each configuration of the firstmask-holding portion 23 a from a to b.

The first mask-holding portion 23 a includes a holding portion 38 a(first member) which holds the lower surface of the mask M, a lowerblock portion 39 a (second member) in which a portion is fixed to thestage main body 22, a hinge portion 40 a (connection member, supportportion) which is a support portion supporting the holding portion 38 ato change the position (a relative positional relationship between theholding portion 38 a and the lower block portion 39 b changes) of theholding portion 38 a along the X axis direction with respect to thelower block portion 39 a according to deformation of the mask M, and anupper block portion 41 a in which a portion is fixed to the lower blockportion 39 a and which is disposed at the upper surface of the lowerblock portion 39 a.

The holding portion 38 a is configured of a holding surface 42 a whichholds the mask M by vacuum suction, a mask suction tube 43 a which isformed to pass through the holding portion 38 a and the stage main body22 from the holding surface 42 a and communicates with a vacuumapparatus (not shown), a first suction pocket 44 a (action surface)which is formed on the lower surface of the holding portion 38 a andforms a predetermined space between the first suction pocket and theupper surface of the stage main body 22, and a first communication tube45 a (gas flow port) which passes through the stage main body 22 fromthe first suction pocket 44 a and communicates with the vacuum apparatus(not shown).

The holding surface 42 a has high flatness, sets the mask suction tube43 a to a predetermined negative pressure, and thus, suctions and holdsthe mask M which is disposed on the holding surface 42 a. Moreover, thefirst communication tube 45 a is formed in plural along the Y axisdirection. Furthermore, in the present embodiment, a gap (an intervalbetween the upper surface of the stage main body 22 and the surface ofthe first suction pocket 44 a opposite to the upper surface of the stagemain body 22) of the first suction pocket 44 a is 10 μm. Moreover, inthe present embodiment, a pressure, which can be set in the firstsuction pocket 44 a via the first communication tube 45 a, is 0 Pa to−55 kPa, and the plurality of first communication tubes 45 a can setintake pressures independently of one another. The first suction pocket44 a and the first communication tube 45 a will be described below.

The lower block portion 39 a is fixed to the stage main body 22 by thefirst connection portion 46 a, and the lower block portion 39 a and theupper block portion 41 a are fixed to each other by a second connectionportion 47 a. Moreover, a first slit 48 a is formed so that an openingis formed in the stage main body 22 side. In the upper block portion 41a, a second slit 49 a is formed so that an opening is formed on theupper surface side of the lower block portion 39 a to correspond to thefirst slit 48 a in the Z direction. Moreover, a second suction pocket 50a (action surface) is formed between the lower surface of the upperblock portion 41 a and the upper surface of the lower block portion 39a, and a second communication tube 51 a (gas flow port) is formed whichpasses through the lower block portion 39 a and the stage main body 22from the second suction pocket 50 a and communicates with the vacuumapparatus (not shown).

The second communication tube 51 a is formed in plural along the Y axisdirection. Furthermore, in the present embodiment, a gap (an intervalbetween the upper surface of the lower block portion 39 a and thesurface of the second suction pocket 50 a opposite to the upper surfaceof the lower block portion 39 a) of the second suction pocket 50 a is 10μm. In addition, in the present embodiment, similar to the inner portionof the first suction pocket 44 a, a pressure, which can be set in thesecond suction pocket 50 a via the second communication tube 51 a, is 0Pa to −55 kPa. The plurality of second communication tubes 51 a can setintake pressures independently of one another. The second suction pocket50 a and the second communication tube 51 a will be described below.

In the present embodiment, the hinge portion 40 a is a support portionwhich connects the holding portion 38 a and the lower block portion 39a. The hinge portion 40 a is integrally formed with the holding portion38 a and the lower block portion 39 a. The hinge portion 40 a, theholding portion 38 a, and the lower block portion 39 a are formed ofceramic. In the present embodiment, the lower block portion 39 a isfixed to the stage main body 22 by the first connection portion 46 a.Accordingly, the hinge portion 40 a is connected between the holdingportion 38 a and the lower block portion 39 a so that the holdingportion 38 a is able to displace in the X axis direction with respect tothe lower block portion 39 a.

The first suction pocket 44 a, the first communication tube 45 a, thesecond suction pocket 50 a, and the second communication tube 51 a willbe described with reference to FIG. 7.

FIG. 7 is an enlarged cross-sectional view of the mask-holding portion23 showing an example of deformation of the mask M in the presentembodiment.

In the present embodiment, the intake pressures of the firstcommunication tube 45 a and the second communication tube 51 a each areconfigured so as to be adjusted independently. As shown in FIG. 7A, theintake pressure of the second communication tube 51 a is set to behigher than the intake pressure of the first communication tube 45 a togenerate a predetermined differential pressure, and thus, the holdingportion 38 a is driven counterclockwise (the holding portion 38 a isinclined to rise in the +X direction) around the Y axis with the firstconnection portion 46 a (not shown in FIG. 7A), in which the lower blockportion 39 a is fixed to the stage main body 22, as the supportingpoint. In other words, the holding portion 38 a is inclined to be madehigher in a portion positioned in the +X direction side. Accordingly, acounterclockwise bending moment is affected around the Y axis in the −Xside end portion of the mask M.

In addition, as described above, the configuration of the firstmask-holding portion 23 a and the configuration of the secondmask-holding portion 23 b in the present embodiment are Z-axissymmetrical with respect to the opening 24. Accordingly, similar to thefirst mask-holding portion 23 a, also in the second mask-holding portion23 b, the intake pressure of the second communication tube 51 b (gasflow port) is set to be higher than the intake pressure of the firstcommunication tube 45 b (gas flow port) to generate a predetermineddifferential pressure, and thus, the holding portion 38 b (first member)is driven clockwise (the holding portion 38 b is inclined to lower inthe +X direction) around the Y axis with the first connection portion 46b, in which the lower block portion 39 b (second member) is fixed to thestage main body 22, as the supporting point. In other words, the holdingportion 38 b is inclined to be made higher in a portion positioned inthe −X direction side. Accordingly, a clockwise bending moment isaffected around the Y axis in the end portion of the +X side of the maskM.

That is, since the first mask-holding portion 23 a and the secondmask-holding portion 23 b which hold the mask M are inclined indirections different from each other, the mask M is deformed to be aprotruding shape in the +Z direction. Here, the bending moment is aforce which deforms the mask M.

On the other hand, as shown in FIG. 7B, the intake pressure of thesecond communication tube 51 a is set to be lower than the intakepressure of the first communication tube 45 a to generate apredetermined differential pressure, and thus, the holding portion 38 ais driven clockwise (the holding portion 38 a is inclined to lower inthe +X direction) around the Y axis with the first connection portion 46a (not shown in FIG. 7B), in which the lower block portion 39 a is fixedto the stage main body 22, as the supporting point. In other words, theholding portion 38 a is inclined to be made higher in a portionpositioned in the −X direction side. Accordingly, a clockwise bendingmoment is affected around the Y axis at the −X side end portion of themask M. Moreover, in the second mask-holding portion 23 b which ispositioned in the +X side with respect to the opening 24, a differentialpressure similar to the above is set, and thus, the holding portion 38 bis driven counterclockwise (the holding portion 38 b is inclined to risein the +X direction) around the Y axis with the first connection portion46 b, in which the lower block portion 39 b is fixed to the stage mainbody 22, as the supporting point. In other words, the holding portion 38b is inclined to be made higher in a portion positioned in the +Xdirection side. Accordingly, a counterclockwise bending moment isaffected around the Y axis in the end portion of the +X side of the maskM. Therefore, the mask M is deformed to be a protruding shape in the −Zdirection.

For example, when the mask M is deformed from the shape (refer to FIG.6) parallel to the X axis to the protruding shape in the +Z direction(refer to FIG. 7A), the intake pressure of the second communication tube51 a is set to be higher than that of the first communication tube 45 a,and posture (inclination or the like) of the holding portion 38 a(holding surface 42 a) is changed to rise in the +X direction from theshape parallel to the X axis. At this time, the −X side end portion ofthe mask M is displaced in the +X direction with respect to the stagemain body 22 as a change amount of the inclination (posture) of theholding portion 38 a is increased. According to a displacement amount ofthe −X side end portion of the mask M, the hinge portion 40 a connectedto the holding portion 38 a extends in the +X direction with respect tothe lower block 39 a. That is, the relative positional relationshipbetween the holding portion 38 a and the lower block 39 a is changed viathe hinge portion 40 a.

On the other hand, when the mask M is deformed from the protruding shape(refer to FIG. 7A) in the +Z direction to the shape (refer to FIG. 6)parallel to the X axis, the intake pressure of the first communicationtube 45 a and the intake pressure of the second communication tube 51 aare the same as each other, and thus, the inclination (posture) of theholding portion 38 a (holding surface 42 a) is changed from the state ofrising in the +X direction to the state of being parallel to the X axis.At this time, the −X side end portion of the mask M is displaced in the−X direction with respect to the stage main body 22 as the change amountof the inclination (posture) of the holding portion 38 a is increased.According to a displacement amount of the −X side end portion of themask M, the hinge portion 40 a connected to the holding portion 38 a iscontracted in the −X direction with respect to the lower block 39 a.That is, the relative positional relationship between the holdingportion 38 a and the lower block 39 a is changed via the hinge portion40 a.

That is, in the present embodiment, the hinge portion 40 a is connectedto the holding portion 38 a so that the position of the holding portion38 a is changed along the X axis direction according to the change ofthe inclination (posture) of the holding portion 38 a (holding surface42 a).

Accordingly, a shearing force, which is generated in the X axisdirection in an interface between the holding surface 42 a of theholding portion 38 a and the mask M, can be suppressed. Therefore, sincea force (for example, the suction force) holding the mask M in theholding portion 38 a is not decreased also by the shearing force whichis generated at the interface between the holding surface 42 a and themask M, the mask M can be deformed to a desired shape without beingdetached from the holding portion 38 a. Accordingly, the change of thepattern image surface of the mask M due to the aberration change of theprojection optical system PL can be sufficiently corrected, and thepattern formed on the mask M can be precisely exposed to the substrateW.

Moreover, according to the differential pressure between the intakepressure of the first communication tube 45 a and the intake pressure ofthe second communication tube 51 a, a slit interval between the firstslit 48 a and the second slit 49 a is expanded and contracted, and thus,a movable range of the first mask-holding portion 23 a is increased, andthe bending moment around the Y axis can be effectively affected to themask M.

Moreover, in the present embodiment, the suction pressures of the firstcommunication tube 45 a and the second communication tube 51 a are −55kPa at maximum. However, the suction pressures need not be −55 kPa andmay be further increased according to the deformation amount of the maskM.

Furthermore, in the present embodiment, negative pressures are set inthe first suction pocket 44 a and the second suction pocket 50 a.However, positive pressures may be set. When the positive pressures areset, a compression apparatus may be connected to the first communicationtube 45 a and the second communication tube 51 a.

In addition, in the present embodiment, the first suction pocket 44 aand the first communication tube 45 a, and the second suction pocket 50a and the second communication tube 51 a form two driving units whichdrive the holding portion 38 a independently. However, the number of thedriving units need not be two. For example, the number of the drivingunits may be three or more, and the holding portion 38 a can be drivenwith higher accuracy by increasing the driving units.

Moreover, in the present embodiment, the first suction pocket 44 a andthe second suction pocket 50 a communicate with the first communicationtube 45 a and the second communication tube 51 a, respectively. However,the first suction pocket 44 a and the second suction pocket 50 a neednot be present, and one of either may be present. For example, when thefirst suction pocket 44 a is not present, the other end of the firstcommunication tube 45 a connected to the vacuum apparatus (not shown) isconnected to the lower surface of the holding portion 38 a, and anegative pressure is set in the first communication tube 45 a.

Moreover, in the present embodiment, gaps of the first suction pocket 44a and the second suction pocket 50 a are 10 μm. However, the gaps neednot be 10 μm. Moreover, the gaps of the first suction pocket 44 a andthe second suction pocket 50 a may be different from each other.

Furthermore, in the present embodiment, the hinge portion 40 a isintegrally formed with the lower block portion 39 a and the holdingportion 38 a. However, the hinge portion need not be integrally formed.For example, the hinge portion 40 a is formed of a plate spring as aseparate member, and may be fixed to the lower block portion 39 a andthe holding portion 38 a. For example, the separate member may bestainless steel or titanium.

In addition, in the present embodiment, first slits 48 a are provided atthe lower block portion 39 a of the first mask-holding portion 23 a, andsecond slits 49 a are provided at the upper block portion 41 a. However,the slits need not be provided. Moreover, in the present embodiment,single slit is cutted as the first slits 48 a and the second slits 49 arespectively. However, the slits need not be provided single, and may becut in plurality.

Moreover, instead of the slits, a configuration shown in FIG. 8 may beadopted. The configuration of FIG. 8 is different from that of FIG. 6 inthat a rotating portion 52 a, which is formed at a block portion 50 aand is fixed to the stage main body 22 by a third connection portion 57a, is provided. A third communication tube 54 a (gas flow port) and afourth communication tube 56 a, which are connected to the vacuumapparatus (not shown) in the left and right of the rotating portion 52a, oppositely communicate with the third suction pocket 53 a (actionsurface) and the fourth suction pocket 55 a (action surface),respectively. In the case of this configuration, according to thedifferential pressure between the intake pressure of the third suctionpocket 53 a and the intake pressure of the fourth suction pocket 55 a,the holding portion 38 a is driven with the rotating portion 52 a as thesupporting point, and a clockwise or counterclockwise bending moment inthe Y axis is affected to the mask M.

Furthermore, in the present embodiment, the hinge portion 40 a need notbe a hinge as long as the hinge portion is at least an elastic bodywhich is displaced in the X axis direction. For example, a spring membermay be used, and the hinge and the spring member may be combined.

Moreover, in the present embodiment, as the driving units which drivethe holding portion 38 a, the first suction pocket 44 a and the secondsuction pocket 50 a, and the first communication tube 45 a and thesecond communication tube 51 a which are opposite to the suction pocketsand suction the pockets are adopted. However, the holding portion 38 aneed not be driven by the intake pressure described above.

For example, the holding portion 38 a may be driven using anelectromagnetic force. For example, in this case, magnets are positionedat the positions of the first suction pocket 44 a and the second suctionpocket 50 a, and two voice coil motors are configured by installingcoils to each of the stage main body 22 opposite to the magnet providedat the first suction pocket 44 a and the upper surface of the lowerblock portion 39 a opposite to the magnet provided at the second suctionpocket 50 a, and thus, the holding portion 38 a may be driven by theelectromagnetic force from the voice coil motors.

Furthermore, for example, the holding portion 38 a may be driven using apiezoelectric element. For example, in this case, piezo elements areinstalled at positions of the first suction pocket 44 a and the secondsuction pocket 50 a, respectively, and the holding portion 38 a may bedriven by pressing the surfaces opposite to respective piezo elements.

Next, an example of a basic operation of the exposure apparatus EXincluding the above-described configuration will be described withreference to FIG. 9.

FIG. 9 is a schematic flowchart for illustrating an example of theoperation of the exposure apparatus EX in the present embodiment, andshows an example of a process of a basic exposure processing.

First, the mask M is transported to the holding portion 38 a (38 b) ofthe mask stage MS by driving of a transportation system including arobot arm (not shown), and is suctioned and held (Step 101).

Subsequently, the substrate W is loaded on the substrate table WT by thedriving of the transportation system including the robot arm (not shown)(Step 102).

Alignment of the loaded substrate W is performed (Step 103).Specifically, first, a plurality of substrate alignment marks (notshown) formed on the plurality of exposure regions (shot) of thesubstrate W are detected by a substrate alignment system WA, andarrangements of all exposure regions (shot) of the substrate W areassumed by performing Enhanced Global Alignment (EGA) processingdisclosed in Japanese Unexamined Patent Application, First PublicationNo. S61-44429 (corresponding to U.S. Pat. No. 4,780,617). Subsequently,the substrate reference mark (not shown) provided on the substrate tableWT is detected by the substrate alignment system WA, and a positionalrelationship between the substrate alignment system WA and the substratereference mark is measured. Moreover, in Step 103, during EGA processingand while the substrate reference mark is detected, the positions (focuspositions) and postures (θX, θY) in the Z direction of each exposureregion (shot) of the substrate W are sequentially measured.

Subsequently, the liquid immersion region AR is formed (Step 104).Specifically, a liquid supply operation to the substrate W (substratetable WT) starts by the driving of the liquid supply apparatus, a liquidrecovery operation from the substrate W (substrate table WT) starts bythe driving of the liquid recovery apparatus, and thus, the liquidimmersion region AR is formed between the lower surface of the liquidimmersion apparatus 15 and the lower surface of the terminal opticalelement 14 (lower surface of the projection optical system PL), and thesubstrate W (substrate table WT).

Subsequently, it is determined whether or not the substrate W subjectedto the exposure from now on is the first substrate of a lot (Step 105).

In Step 105, when it is determined that the substrate W subjected to theexposure from now on is the first substrate of the lot, the Z positionof the lower surface (pattern surface) of the mask M with respect to thereference surface 61 of the reference member 60 is measured and thedisplacement amount in the Z direction of the mask M with respect to thereference surface 61 is measured (Step 106) by a surface positionmeasurement system (not shown). More specifically, the mask stage MS isdriven via the mask stage-driving apparatus (not shown) by thecontroller CONT, and the detection light is sequentially radiated to aplurality of points of the reference surface 61 of the reference member60 and the lower surface (pattern surface) of the mask M by the surfaceposition measurement system (not shown). Subsequently, the Z position ofthe lower surface (pattern surface) of the mask M with respect to thereference surface 61 is measured by receiving the reflected light, andthe shape of the mask M is measured.

Subsequently, the deformation amount in which the mask M is deformed bythe mask-holding portion 23 is obtained (Step 107).

In this step, based on the provisional deformation amount of the mask Mand the shape of the mask M measured in Step 106 in the provisionaldeformation amount of the mask M for correcting the change of thepattern image surface of the mask M and the set value of the lenscontroller LC which are precalculated, the deformation amount of themask M which is deformed by the mask-holding portion 23 in the laterStep 108 is calculated.

Moreover, the provisional deformation amount of the mask M and the setvalue of the lens controller LC, which are precalculated, are obtainedso that the change amount of the pattern image surface of the mask M isobtained by the aberration change of the projection optical system PLwhen the substrates having the lot sheets in an arbitrary lot areexposed, and the change of the pattern image surface is decreased. Thatis, in the present embodiment, the provisional deformation amount of themask M and the set value of the lens controller are calculated inadvance for each lot.

Moreover, for example, with the measurement of the aberration change ofthe projection optical system PL, a measurement apparatus of PCTInternational Publication No. WO 2006/016584 (corresponding to U.S. Pat.No. 7,667,829) is used.

Subsequently, the holding portion 38 a (38 b) is inclined based on thedeformation amount of the mask M calculated in Step 107, and thus, themask M is deformed (Step 108). Moreover, in the present step, the lenscontroller LC is set based on the set value of the lens controller LCcalculated in Step 107. That is, in the present embodiment, the changeof the pattern image surface of the mask M is corrected by making thedeformation of the shape of the mask M and the lens controller LCcooperate.

Subsequently, the alignment of the loaded mask M is performed (Step109). Specifically, the mask alignment mark (not shown) formed on themask M and the mask reference mark (not shown) provided on the substratetable WT are simultaneously detected by the mask alignment system MA viathe liquid immersion region AR formed in Step 104 and the projectionoptical system PL, and the positional relationship between the maskalignment mark and the mask reference mark is measured. At this time,according to the positional relationship between the substrate alignmentsystem WA and the substrate reference mark measured in Step 103 and thepositional relationship between the mask alignment mark and the maskreference mark measured in the present Step 109, the positionalrelationship between the substrate alignment system WA and the maskalignment mark is calculated, and a baseline amount which is an intervalbetween the substrate alignment system WA and the pattern image of themask M is calculated.

Then, based on the arrangement of the exposure region (shot) assumed inStep 103, the position (focus position) and the posture (θX, θY) in theZ direction of each exposure region (shot) measured in Step 103, and thebaseline amount measured in Step 109, the pattern image of the mask M issequentially exposed to each exposure region (each shot) on thesubstrate W (Step 110).

On the other hand, in Step 105, when it is determined that the substrateW subjected to the exposure from now on is not the first substrate ofthe lot, the substrate W is exposed via the liquid immersion region AR(Step 110).

In addition, after the substrate W is exposed in Step 110, it isdetermined whether or not the substrate W is the final substrate in thelot (Step 111).

When it is determined that the substrate W is the final substrate in thelot in Step 111, the used mask M is unloaded from the mask stage MS, anda new mask M is loaded in the mask stage MS in Step 101.

On the other hand, when it is determined that the substrate W is not thefinal substrate in the lot in Step 111, a new substrate W is loaded onthe substrate table WT in Step 102.

In the operation of the exposure apparatus EX of the present embodimentdescribed above, by changing the mask M to a desired shape (whilecooperating with the lens controller LC) according to the change of thepattern image surface of the mask M due to the aberration change of theprojection optical system PL, the change of the pattern image of themask M is sufficiently corrected, and the pattern formed on the mask Mcan be precisely exposed to the substrate W.

In addition, in the present embodiment, the set value of the lenscontroller LC and the deformation amount of the shape of the mask M arecalculated for each lot, but need not be calculated for each lot. Forexample, the set value and the deformation amount may be calculated foreach exposed substrate, and thus, the lens controller LC and the shapeof the mask M may be set for each substrate.

Furthermore, in the present embodiment, the provisional deformationamount of the mask M and the set value of the lens controller LC forcorrecting the change of the pattern image surface of the mask M arecalculated in advance. However, by measuring the aberration of theprojection optical system PL at a predetermined timing during theexposure processing of the substrate W (from Step 101 to Step 110), theset value of the lens controller LC and the deformation amount of themask M may be obtained to correct the image surface shape of the patternimage of the mask M due to the aberration.

Moreover, in the present embodiment, the change of the pattern imagesurface of the mask M is corrected by making the setting of the lenscontroller LC and the deformation of the shape of the mask M cooperatewith each other. However, the correction may be performed by deformingonly the shape of the mask M without using the lens controller LC.

In this case, the provisional deformation amount of the mask M, whichcorrects the change of the pattern image surface of the mask M by theaberration change of the projection optical system PL when thesubstrates having the lot sheets in an arbitrary lot are exposed, isobtained in advance. Based on the provisional deformation amount of themask M and the shape of the mask M measured in Step 106, the deformationamount of the mask M which is deformed by the mask-holding portion 23 iscalculated in Step 108, and the mask M may be deformed.

<Modification>

Next, a modification of the mask-holding portion 23 of the presentembodiment will be described with reference to FIGS. 10 and 11.

FIG. 10 is a modification of the mask-holding portion 23 according tothe first embodiment.

FIG. 11A is an enlarged view of a first mask-holding portion 68 a (firstholding portion) of FIG. 10, and FIG. 11B is a cross-sectional viewtaken along C-C in the enlarged view of the first mask-holding portion68 a of FIG. 11A.

As shown in FIG. 10, in this modification, the configurations differentfrom those of the mask-holding portion 23 (refer to FIGS. 3 and 6) arethat the first mask-holding portion 68 a including division-holdingportions 78 a, 88 a, and 98 a divided into three along the Y axis, andthe second mask-holding portion 68 b (second holding portion) includingdivision-holding portions 78 b, 88 b, and 98 b are provided.

Since the first mask-holding portion 68 a and the second mask-holdingportion 68 b have the Z-axis symmetrical structure with respect to theopening 24, only the first mask-holding portion 68 a will be described.

As shown in FIG. 11A, the first mask-holding portion 68 a includes thedivision-holding portions 78 a, 88 a, and 98 a which suctions and holdsthe −X side end portion of the mask M at three places along the Y axis.The hinge portion 40 a (not shown in FIG. 11) shown in FIG. 6 isconnected to each of the division-holding portions 78 a, 88 a, and 98 a.In this modification, the hinge portion 40 a is connected to each of thedivision-holding portions 78 a, 88 a, and 98 a so that each of theholding surfaces holding the mask M of the division-holding portions 78a, 88 a, and 98 a is inclined in the Y axis direction.

According to this configuration, with respect to the configuration whichholds the mask M on the flat surface, as shown in FIG. 11B, the mask Mcan be suctioned and held by the division-holding portions 78 a, 88 a,and 98 a according to the shape of the lower surface of the mask M, andthus, distortion occurring in the held mask M can be suppressed.

Therefore, the deformation of the shape of the mask M in Step 108 inFIG. 9 can be easily performed.

Second Embodiment

Next, a second embodiment of the present invention will be describedwith reference to FIG. 12.

In descriptions below, the same reference numerals are assigned to thesame or the equivalent components as the above-described embodiment, andthe descriptions are simplified or omitted.

FIG. 12 is an enlarged cross-sectional view of the first mask-holdingportion 23 a of the −X side according to the present embodiment.

In the present embodiment, since the first mask-holding portion 23 a andthe second mask-holding portion 23 b have the Z-axis symmetricalstructure with respect to the opening 24, descriptions of theconfiguration of the second mask-holding portion 23 b are omitted.

As shown in FIG. 12, in the first mask-holding portion 23 a of thepresent embodiment, instead of the hinge portion 40 a (refer to FIG. 6)of the first embodiment, a guide portion 58 a (guide member) is disposedbetween the lower block portion 39 a and the holding portion 38 a as asupport portion which supports the holding portion 38 a in a freelydisplaceable manner in the X axis direction.

The guide portion 58 a is a linear guide which is configured of a rail(not shown) extending in the X axis direction and a movable body (notshown) fitted to the rail. In order to decrease the sliding frictionbetween the rail and the movable body, the movable body is fitted to therail via a plurality of balls (rolling elements) which roll along the Xaxis direction and can move on the rail along the X axis direction.

For example, in this case, the intake pressure of the secondcommunication tube 51 a is set to be higher than the intake pressure ofthe first communication tube 45 a to generate a predetermineddifferential pressure, and thus, the holding portion 38 a is drivencounterclockwise (the holding portion 38 a is inclined to rise in the +Xdirection) around the Y axis, and a counterclockwise bending moment isaffected in the Y axis in the −X side end portion of the mask M (referto FIG. 7A). At this time, the − side end portion of the mask M isdisplaced by a predetermined displacement amount in the +X direction,and the holding portion 38 a fixed to the movable body (not shown) ofthe guide portion 58 a is displaced in the +X direction with respect tothe lower block portion 39 a according to the predetermined displacementamount.

That is, in the present embodiment, the guide portion 58 a changes theposition of the holding portion 38 a in the X axis direction accordingto the inclination (posture) of the holding portion 38 a.

In the present embodiment, the guide portion 58 a supports the holdingportion 38 a to be approximately independent of other configurations(for example, the lower block portion 39 a). Accordingly, when theholding portion 38 a is displaced, it is possible to smoothly change theposition of the holding portion 38 a in the X axis direction withoutaffecting stress to other configurations.

As described above, in the interface between the mask M and the holdingsurface 42 a of the holding portion 38 a, the shearing force occurringin the X axis direction can be suppressed, and the mask M can bedeformed to a desired shape. Accordingly, the change of the patternimage surface of the mask M due to the aberration change of theprojection optical system PL can be sufficiently corrected, and thepattern formed on the mask M can be precisely exposed to the substrateW.

Furthermore, in the present embodiment, the holding portion 38 a isfixed to the movable body (not shown) of the guide portion 58 a.However, the movable body may be set to the holding portion 38 a.

Moreover, in the present embodiment, the linear guide, which uses theplurality of rolling elements rolling in the X axis direction as thesupport portion supporting the holding portion 38 a in a freelydisplaceable manner in the X axis direction, is adopted. However, forexample, an air guide, which supports the holding portion 38 a in anon-contact manner with respect to the lower block portion 39 a by airpressure and in a freely displaceable manner in the X axis direction,may be used, and a single-axis linear motor, which moves the holdingportion 38 a in the X axis direction by an electromagnetic force, may beadopted. When the single-axis linear motor is adopted, a movement amountin the X axis direction of the holding portion 38 a is controlled by thecontroller CONT (refer to FIG. 1) according to the displacement amountin the X direction of the end portion of the mask M which is displacedby the bending moment.

Furthermore, for example, the present invention may be applied to anexposure apparatus in which patterns of two masks are combined on thesubstrate via the projection optical system and one shot region on thesubstrate is approximately simultaneously double-exposed by singlescanning exposure, as disclosed in U.S. Pat. No. 6,611,316, or the like.Moreover, the present invention may be also applied to an exposureapparatus of a proximity system, a mirror projection aligner, or thelike.

Furthermore, the present invention may be also applied to an exposureapparatus of a twin-stage type which includes a plurality of substratestages, as disclosed in U.S. Pat. No. 6,400,441, PCT InternationalPublication No. WO 98/28665, U.S. Pat. No. 6,341,007, U.S. Pat. No.6,400,441, U.S. Pat. No. 6,549,269, U.S. Pat. No. 6,590,634, U.S. Pat.No. 6,208,407, U.S. Pat. No. 6,262,796, or the like.

Moreover, the kind of exposure apparatus EX is not limited to theexposure apparatus for manufacturing a semiconductor element whichexposes a semiconductor element pattern on the substrate W, and theexposure apparatus EX may be also widely applied to an exposureapparatus for manufacturing a liquid crystal display element or adisplay, or an exposure apparatus for manufacturing a thin film magnetichead, an imaging element (CCD), a micromachine, a MEMS, a DNA chip, areticle, a mask, or the like.

Furthermore, in each of the above-described embodiments, respectivepositions of the mask stage MS and the substrate table WT are measuredusing the mask side laser interferometer 19 and the substrate side laserinterferometer 17. However, the present invention is not limited tothis, and for example, an encoder system which detects scale(diffraction grating) provided at the mask stage MS and the substratetable WT may be used. In this case, it is preferable to adopt a hybridsystem, which includes both of at least one of the mask side laserinterferometer 19 and the substrate side laser interferometer 17, andthe encoder system, and performing a correction (calibration) of themeasured results of the encoder system by using the measured results ofat least one of the mask side laser interferometer 19 and the substrateside laser interferometer 17. In addition, the positional control of thestage may be performed by using at least one of the mask side laserinterferometer 19 and the substrate side laser interferometer 17 and theencoder system while switching with each other, or using both of atleast one of the mask side laser interferometer 19 and the substrateside laser interferometer 17 and the encoder system.

Furthermore, in the above-described embodiments, ArF excimer laser isused. However, for example, as disclosed in U.S. Pat. No. 7,023,610, aharmonic generation apparatus may be used, which includes a solid laserlight source such as a DFB semiconductor laser or a fiber laser, lightamplification portion having a fiber amplifier or the like, a wavelengthconversion portion, or the like, and outputs a pulse light having awavelength of 193 nm. Moreover, in the above-described embodiments, eachillumination region and each projection region described above have arectangular shape, however, they may have other shapes, for example, anarc shape or the like.

Moreover, in each embodiment described above, the light transmissiontype mask is used in which a predetermined light-shielding pattern (or aphase pattern, a dimming pattern) is formed on the substrate havinglight transparency. However, instead of this mask, for example, asdisclosed in U.S. Pat. No. 6,778,257, a variable molding mask (alsoreferred to as an electronic mask, an active mask, or an imagegenerator) may be used which forms a transparent pattern, a reflectivepattern, or a light-emitting pattern based on electronic data of thepattern to be exposed. For example, the variable molding mask includesDigital Micro-mirror Device (DMD) which is a kind of a non-lightemission type image display element (spatial light modulator), or thelike. Moreover, the variable molding mask is not limited to DMD, andinstead of DMD, a non-light emission type image display elementdescribed below may be used. Here, the non-light emission type imagedisplay element is an element which spatially modulates amplitude(intensity), phase, or a polarization state of the light advancing in apredetermined direction, and as a transmission type spatial lightmodulator, a transmission type liquid crystal display element (LiquidCrystal Display: LCD), an electrochromic display (ECD), or the like isexemplified. Moreover, as a reflection type spatial light modulator, inaddition to the above-described DMD, a reflection mirror array, areflection type liquid crystal display element, Electro Phonetic Display(EPD), electronic paper (or electronic ink), a diffraction-type lightvalve (Grating Light Valve), or the like is exemplified.

Furthermore, instead of the variable molding mask including thenon-light emission type image display element, a pattern-formingapparatus including a spontaneous light emission type image displayelement may be provided at this case, an illumination system is notneeded. Here, as the spontaneous light emission type image displayelement, for example, Cathode Ray Tube (CRT), InorganicElectroluminescence Display, Organic Electroluminescence Display(Organic Light-Emitting Diode (OLED)), LED display, LD display, FieldEmission Display (FED), Plasma Display (Plasma Display Panel (PDP)), orthe like is exemplified. Moreover, as the spontaneous light emissiontype image display element included in the pattern-forming apparatus, byusing a solid light source chip including a plurality of light-emittingpoints, a solid light source chip array in which chips are arranged in aplurality of arrays, a type in which a plurality of light-emittingpoints are formed in a single substrate, or the like, the solid lightsource chip is electrically controlled, and a pattern may be formed.Moreover, the solid light source element may be either an inorganicelement or an organic element.

Moreover, for example, the present invention may be also applied to anexposure apparatus (a lithography system) in which interference fringesare formed on the substrate W, and thus, a line-and-space pattern isexposed on the substrate W, as disclosed in PCT InternationalPublication No. WO 2001/035168.

As described above, the exposure apparatuses EX of the presentembodiments are manufactured by assembling various subsystems includingeach component so as to maintain predetermined mechanical accuracy,electrical accuracy, and optical accuracy. In order to secure thevarious accuracies, before and after the assembly, adjustment forachieving optical accuracy with respect to various optical systems,adjustment for achieving mechanical accuracy with respect to variousmechanical systems, and adjustment for achieving electrical accuracywith respect to various electrical systems are performed. The process ofassembling the exposure apparatus from various subsystems includesmechanical connections, wiring connections of electric circuits, pipingconnections of air-pressure circuits, or the like between varioussubsystems. The respective assembly processes of each subsystem areneeded before the assembly process from the various subsystems to theexposure apparatus. If the assembly process from various subsystems tothe exposure apparatus ends, a general adjustment is performed, andthus, various accuracies in the overall exposure apparatus are secured.Moreover, it is preferable that the manufacturing of the exposureapparatus be performed in a clean room in which temperature, degree ofcleanness, or the like is managed.

Next, a manufacturing method of a micro-device such as a semiconductordevice using the above-described exposure apparatus EX will be describedwith reference to FIG. 13.

FIG. 13 is a flowchart showing an example of a manufacturing process ofa micro-device. As shown in FIG. 13, a micro-device such as asemiconductor device is manufactured through a step 201 in which thefunction and performance design of the micro-device is performed, a step202 in which a mask (reticle) is manufactured based on the design step,a step 203 in which a substrate which is a base material of the deviceis manufactured, a substrate-processing step 204 which includes thesubstrate-processing (exposure processing) including exposing thesubstrate by the exposure light via the mask M according to theabove-described embodiments and developing the exposed substrate, adevice assembly step (which includes manufacturing processes such as adicing process, a bonding process, and a package process) 205, aninspection step 206, or the like.

Moreover, the conditions of each embodiment and the modificationsdescribed above may be appropriately combined. Furthermore, thedisclosures of all publications and United States Patents cited in eachembodiment described above are cited, and become a portion of thedisclosures of the present application.

BRIEF DESCRIPTION OF THE REFERENCE SYMBOLS

M: mask (object, plate-like object, optical member, plate-like opticalmember), 1: mask stage apparatus (holding apparatus, base material), MS:mask stage, 22: stage main body (base), 23: mask-holding portion(holding portion), 23 a: first mask-holding portion (first holdingportion), 23 b: second mask-holding portion (second holding portion), 25a, 25 b: movable element, 38 a, 38 b: holding portion (first member), 39a, 39 b: lower block portion (second member), 40 a: hinge portion(connection member, support portion), 44 a: first suction pocket (actionsurface), 45 a, 45 b: first communication tube (gas flow port), 46 a, 46b: first connection portion, 50 a: second suction pocket (actionsurface), 51 a, 51 b: second communication tube (gas flow port), 53 a:third suction pocket (action surface), 54 a: third communication tube(gas flow port), 55 a: fourth suction pocket (action surface), 68 a:first mask-holding portion (first holding portion), 68 b: secondmask-holding portion (second holding portion), 78 a, 78 b, 88 a, 88 b,98 a, 98 b: division-holding portion, 58 a: guide portion (guide member)

The invention claimed is:
 1. A holding apparatus configured to hold anobject so that at least a portion of the object is set along a planewith respect to a base, the plane including a first axis and a secondaxis orthogonal to the first axis, the holding apparatus comprising: aholding portion that comprises a first portion which contacts at leastthe portion of the object, a second portion which at least a portionthereof is fixed to the base, and a connection portion which isconfigured to connect the first and second portions; and a driving unitwhich is configured to deform the object by displacing the first portionin a third axis direction with respect to the second portion, the thirdaxis intersecting the plane, wherein the connection portion is deformedwhen the first portion is displaced in the third axis direction.
 2. Theholding apparatus according to claim 1, wherein the connection portionis configured to change a position of the first portion with respect tothe second portion more largely as a change of the posture of the firstportion is larger.
 3. The holding apparatus according to claim 1,wherein the connection portion is configured to change a relativedistance between the first portion and the second portion according to achange of the posture of the first portion.
 4. The holding apparatusaccording to claim 1, wherein the holding portion comprises a pluralityof first portions which contact different portions of the object.
 5. Theholding apparatus according to claim 1, wherein the object is a plateobject, and wherein the holding portion comprises a first holdingportion which is configured to hold one end portion of the plate objectand a second holding portion which is configured to hold another endportion of the plate object, and the first and second holding portionscomprise the first portion, the second portion, and the connectionportion respectively.
 6. The holding apparatus according to claim 5,wherein the driving unit is configured to bend the plate object bychanging an inclination of the first portion of the first holdingportion and an inclination of the first portion of the second holdingportion in directions different from each other.
 7. The holdingapparatus according to claim 1, wherein the base is moved along thesecond axis, and a plurality of first portions of the holding portionare independently arranged with each other in a direction along thesecond axis.
 8. The holding apparatus according to claim 7, wherein thedriving unit is configured to drive the holding portion to incline thefirst portion along one surface which intersects the direction along thesecond axis, and wherein the connection portion is configured to changea position of the first portion in a direction, which intersects thedirection along the second axis, with respect to the second portion. 9.The holding apparatus according to claim 8, wherein the driving unitcomprises a first driving unit which is configured to drive the holdingportion to incline the first portion, and a second driving unit which isconfigured to incline the first portion in a direction different fromthe direction in which the first driving unit inclines the firstportion.
 10. The holding apparatus according to claim 9, wherein thefirst driving unit is configured to drive the first portion.
 11. Theholding apparatus according to claim 9, wherein the second driving unitis configured to drive the second portion to incline the first portionvia the connection portion.
 12. The holding apparatus according to claim9, wherein at least one of the first driving unit and the second drivingunit comprises a gas flow port through which gas flows, and an actionsurface which is opposite to the gas flow port and on which a pressureof the gas is affected.
 13. The holding apparatus according to claim 12,wherein the pressure of the gas is a negative pressure and a suctionforce is affected on the action surface.
 14. An exposure apparatuscomprising the holding apparatus according to claim 1, wherein theholding apparatus is capable of holding a mask on which a pattern isformed as the object, and wherein the pattern is transferred to asubstrate.
 15. An exposure method using the exposure apparatus accordingto claim 14, the exposure method comprising: deforming the mask; andtransferring the pattern of the mask to the substrate.
 16. Amanufacturing method of a device, the manufacturing method comprising:exposing the substrate using the exposure apparatus according to claim14; and developing the exposed substrate.
 17. A holding apparatusconfigured to hold a mask on which a pattern is formed so that a surfaceof the mask on which the pattern is form is set along a plane withrespect to a base, the plane including a first axis and a second axisorthogonal to the first axis, the holding apparatus comprising: aholding portion that comprises a first portion which contacts a portionof the mask, a second portion to which at least a portion of the base isfixed, and a connection portion which is configured to connect the firstand second portions; and a driving unit which is configured to deformthe mask by displacing the first portion in a third axis direction withrespect to the second portion, the third axis intersecting the plane,wherein the holding portion comprises a first holding portion which isconfigured to hold one end portion of the mask and a second holdingportion which is configured to hold another end portion of the mask, andthe first and second holding portions comprise the first portion, thesecond portion, and the connection portion respectively, wherein thedriving unit is configured to bend the mask by changing an inclinationof the first portion of the first holding portion and an inclination ofthe first portion of the second holding portion in directions differentfrom each other, and wherein the connection is deformed when the firstportion is displaced in the third axis direction.
 18. An exposureapparatus comprising the holding apparatus according to claim 17,wherein the pattern of the mask is transferred to a substrate.
 19. Amanufacturing method of a device, the manufacturing method comprising:exposing the substrate using the exposure apparatus according to claim18; and developing the exposed substrate.
 20. A holding apparatusconfigured to hold an optical member along a plane which comprises afirst axis and a second axis orthogonal to the first axis, the holdingapparatus comprising: a holding portion configured to hold the opticalmember; a driving unit which is configured to deform the optical memberby driving the holding portion and displacing a portion of the holdingportion in a third axis direction that intersects with the plane; and asupport portion which is configured to support the holding portion in afreely displaceable manner with respect to the first axis direction bybeing deformed when the holding portion has been displaced in the thirdaxis direction.
 21. The holding apparatus according to claim 20, whereinthe optical member is a plate optical member, and wherein the holdingportion comprises a first holding portion which holds one end portion ofthe plate optical member in a direction parallel to the second axis anda second holding portion which holds another end portion of the plateoptical member.
 22. The holding apparatus according to claim 20, furthercomprising: a base material in which the holding portion, the drivingunit, and the support portion are disposed.
 23. The holding apparatusaccording to claim 22, further comprising: a base material driving unitwhich is configured to drive the base material along the second axis.24. The holding apparatus according to claim 20, wherein the supportportion comprises an elastic member.
 25. The holding apparatus accordingto claim 24, wherein the elastic member comprises a hinge member. 26.The holding apparatus according to claim 20, wherein the support portioncomprises a guide member which is configured to guide the holdingportion to be movable along a direction parallel to the first axis. 27.The holding apparatus according to claim 26, wherein the guide membercomprises a linear guide which is configured to perform guiding using aplurality of rolling elements which roll along the direction parallel tothe first axis.
 28. The holding apparatus according to claim 20, whereinthe driving unit comprises a first driving unit which is configured toaffect a bending moment to the optical member with respect to onedirection around the second axis, and a second driving unit which isconfigured to affect the bending moment to the optical member withrespect to another direction around the second axis.
 29. The holdingapparatus according to claim 28, wherein at least one of the firstdriving unit and the second driving unit comprises a gas flow portthrough which gas flows, and an action surface which is opposite to thegas flow port and on which a pressure of the gas is affected.
 30. Theholding apparatus according to claim 29, wherein the pressure of the gasis a negative pressure and a suction force is affected on the actionsurface.
 31. An exposure apparatus comprising the holding apparatusaccording to claim 20, wherein the holding apparatus is capable ofholding a mask on which a pattern is formed as the optical member, andwherein the pattern is transferred to a substrate.
 32. An exposuremethod using the exposure apparatus according to claim 31, the exposuremethod comprising: deforming the mask; and transferring a pattern of themask to the substrate.
 33. A manufacturing method of a device, themanufacturing method comprising: exposing the substrate using theexposure apparatus according to claim 31; and developing the exposedsubstrate.